Desktop Type Flip Chip Bonder M-90
Supporting thermo-compression bonding, adhesive bonding,
ultrasonic bonding and various other packaging methods
![](https://hisol.jp/en/wp-content/uploads/2014/08/hisol-logo-400x200.png)
- Simple and highly repeatable packaging can be achieved by the PC software operation system.
- This is the most suitable bonder for optical part packaging, MEMS device assembling, multi-pin BGA packaging and other applications.
- This model covers a wide range of load variation up to 400 N.
Features
- Serves both die bonding and flip chip bonding.
- Compatible with various devices by changing the stage and collet parts.
- Supports thermo-compression bonding, adhesive bonding, metal eutectic bonding, ultrasonic bonding and various other methods.
- Most suitable for fabricating and developing prototypes, and collecting condition setting data of mass-production equipment.
Compatibility of this system with various bonding methods
Data varies depending on materials used.
For details, refer to data provided by material manufacturers.
System specifications
Model | M90 | M95 |
---|---|---|
Function | Manual FC bonder | Manual FC bonder |
Alignment accuracy | ±5.0μm | ±5μm |
Applied load | 50-2000g | 300-40000g |
Alignment | Manual | Manual |
System dimensions
![](https://hisol.jp/en/wp-content/uploads/2014/08/m90_souchi.gif)
Unit dimensions
![](https://hisol.jp/en/wp-content/uploads/2014/08/m90_hontai.gif)
Main body dimensions
Optional parts
Pulse heater, ultrasonic bonding unit, paste squeegee table and stamper, ultraviolet curing lamp, etc.
![](https://hisol.jp/en/wp-content/uploads/2014/08/m90_option01.gif)
Standard workpiece holder
(for O2 concentration of 500 ppm or less)
![](https://hisol.jp/en/wp-content/uploads/2014/08/m90_option02.gif)
Collet for MEMS devices