Desktop Type Flip Chip Bonder M-90

Desktop Type Flip Chip Bonder M-90

Supporting thermo-compression bonding, adhesive bonding,
ultrasonic bonding and various other packaging methods

  • Simple and highly repeatable packaging can be achieved by the PC software operation system.
  • This is the most suitable bonder for optical part packaging, MEMS device assembling, multi-pin BGA packaging and other applications.
  • This model covers a wide range of load variation up to 400 N.


  • Serves both die bonding and flip chip bonding.
  • Compatible with various devices by changing the stage and collet parts.
  • Supports thermo-compression bonding, adhesive bonding, metal eutectic bonding, ultrasonic bonding and various other methods.
  • Most suitable for fabricating and developing prototypes, and collecting condition setting data of mass-production equipment.

Compatibility of this system with various bonding methods

Name of method Eutectic die bonding
Thermo-compression bonding
Au soldering
Anisotropic conductive paste (ACP)
Solder bumping
Die bonding with eutectic metal Bonding Au bumps and Au pads by heating and compression Soldering Au bumps to pads Bonding with anisotropic conductive paste (or film) Bonding metal by soldering
en-fc-bonder-02 en-fc-bonder-02 en-fc-bonder-03 en-fc-bonder-04 en-fc-bonder-05
Compatibility of this system
Functions Heating up to the eutectic material melting point Heating and compression Heating Heating and compression Heating
Temperature Approx. 165°C to 400°C 350-400℃ 220-240℃ 150-220℃ 220-240℃
Required pressure (I/O) N/A 80-100g 2-10g 50-100g 5-10g
Ultrasonic effect
Inert gas Essential Not required Required Not required Required

Data varies depending on materials used.
For details, refer to data provided by material manufacturers.

System specifications

Model M90 M95
Function Manual FC bonder Manual FC bonder
Alignment accuracy ±5.0μm ±5μm
Applied load 50-2000g 300-40000g
Alignment Manual Manual

System dimensions

Unit dimensions

Main body dimensions

Optional parts

Pulse heater, ultrasonic bonding unit, paste squeegee table and stamper, ultraviolet curing lamp, etc.

Standard workpiece holder
(for O2 concentration of 500 ppm or less)

Collet for MEMS devices


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