Automatic Flip Chip Bonder M-400

Automatic Flip Chip Bonder M-400

Automatic flip chip bonder Model-400 supports various packaging technologies:
wafer handling (with trays), flip chip and image processing, alignment, thermo-compression bonding, adhesive bonding (with a dispenser, etc.), and eutectic solder bonding.

Highest-grade automatic flip chip bonder with the alignment accuracy of ±5 microns

By changing adapters, this system can handle and mount a wide range of targets, such as 2 to 8 wafers, waffle trays, adhesive sheet trays, packages, substrates and glass.

Automatic Flip Chip Bonder M-400


  • Most suitable for manufacturing a wide variety of products in small quantities and for trial development because conversion kit can be easily changed.
  • Allows packaging of 4 to 8-inch wafers (including broken or chipped wafers) under PC software control.
  • Available with various optional parts, including a pyramid collet, a pulse heater, a scriber and a stamper.
  • Can be customized to best satisfy user needs in terms of layout, budget, functions, etc.
  • Offered as the only one of its kind system in the world.

Compatibility of this system with various bonding methods

Name of method Eutectic die bonding
Thermo-compression bonding
Au soldering
Anisotropic conductive paste (ACP)
Solder bumping
Die bonding with eutectic metal Bonding Au bumps and Au pads by heating and compression Soldering Au bumps to pads Bonding with anisotropic conductive paste (or film) Bonding metal by soldering
en-fc-bonder-02 en-fc-bonder-02 en-fc-bonder-03 en-fc-bonder-04 en-fc-bonder-05
Compatibility of this system
Functions Heating up to the eutectic material melting point Heating and compression Heating Heating and compression Heating
Temperature Approx. 165°C to 400°C 350-400℃ 220-240℃ 150-220℃ 220-240℃
Required pressure (I/O) N/A 80-100g 2-10g 50-100g 5-10g
Ultrasonic effect
Inert gas Essential Not required Required Not required Required

Data varies depending on materials used.
For details, refer to data provided by material manufacturers.

System specifications

Model Automatic flip bonder M400 α Automatic chip transfer device M400TR
Function Fully automatic bonding or manual alignment by jogging Fully automatic transfer of wafers onto the chip tray, the adhesive tray and the dedicated system tray, etc.
Alignment accuracy ±5.0μm ±10μm
Applied load 50-1000g 50-1000g
Alignment Automatic Automatic

System dimensions

Optional parts

Pulse heater bonding stage
and packaging monitor camera

Continuity test probe stage
and flip-chip unit

20 × 20 mm pulse heater head
Surface temperature distribution at 295°C

Pickup by wafer mapping

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