High Accuracy Flip Chip Bonder M-1300
![](https://hisol.jp/en/wp-content/uploads/2014/08/M1300-2.jpg)
Ultra-high accuracy flip chip bonder with an alignment accuracy of ±1 micron
![](https://hisol.jp/en/wp-content/uploads/2014/08/hisol-logo-400x200.png)
- This system is most suitable for laser-assisted packaging, optical device packaging and other ultra-high accuracy packaging applications.
- PC control provides high repeatability in terms of load, dispensing, heating and other conditions.
- This system allows bonding in an inert gas atmosphere and device orientation control based on laser displacement measurement.
- This system adopts the control method that realizes the highest-grade packaging accuracy among bonders of optical alignment type.
Features
- Ultra-high accuracy flip chip/die bonder developed for high-accuracy packaging of optical parts.
- Compatible with a wide variety of devices by changing the stage and collet parts.
- Adopts the optical alignment to recognize compound device edges and marks in glass parts.
- Allows chip bonding with a low concentration of oxygen (100 ppm or less), orientation control based on laser displacement measurement, high-accuracy packaging and chip bonding to 3D structures.
- Available with an extensive line-up of optional applications.
Compatibility of this system with various bonding methods
Data varies depending on materials used.
For details, refer to data provided by material manufacturers.
System specifications
Model | M1300 |
---|---|
Function | Semi-automatic FC bonder |
Alignment accuracy | ±1.0μm |
Applied load | 50 to 5,000 g (load cell change) |
Alignment | Manual for X- and Y-axes and automatic for θ-axis |
Equipment specifications
![](https://hisol.jp/en/wp-content/uploads/2014/08/1a1f0f404e530d5c0fe3475d204b619f.png)
![](https://hisol.jp/en/wp-content/uploads/2014/08/82bb5cffc7709ee9ebe84e39d1503a2f.png)
Optional parts
Pulse heater, ultrasonic bonding unit, inert gas bonding stage, alignment based on laser displacement measurement, etc.
![](https://hisol.jp/en/wp-content/uploads/2014/08/img_m1300_op01.jpg)
Bonding stage for TO-15
(Chip handling tray shown on this side)
![](https://hisol.jp/en/wp-content/uploads/2014/08/img_m1300_op02.jpg)
PC display for detailed bonding condition settings
![](https://hisol.jp/en/wp-content/uploads/2014/08/img_m1300_op03.jpg)
Void found in bonding with O2 of 1,000 ppm
![](https://hisol.jp/en/wp-content/uploads/2014/08/img_m1300_op04.jpg)
No void in bonding with O2 of 500 ppm